The startup aims to develop and commercialize customized high-performance computing (HPC) systems specifically designed for particle-in-cell (PIC) simulations, which are crucial for modeling plasma processing in semiconductor manufacturing. These HPC systems will be built using advanced components to meet the demanding computational needs of research and development groups in universities and industries across Korea. In addition to providing these HPC systems, the startup will offer education, training, and consultation services on plasma simulations using a variety of specialized multiphysics software, thereby supporting the R&D efforts in both academic and industrial sectors.

We provide dissimilar metal joining solutions that utilize ultrasonic complex vibration technology. Compared to conventional joining technologies (laser, resistance welding, and conventional ultrasonic technology), this technology uses ultrasonic complex vibrations that draw an elliptical orbit to achieve higher joining strength, less damage, less energy, and lower cost. In particular, in lithium-ion batteries, this technology contributes to reduced risk of fire, higher capacity, and reduced environmental impact, and in the semiconductor field, it contributes to improved quality during joining, high-density mounting (packaging), and improved manufacturing efficiency.

The world's first navigation grade MEMs 3DoF accelerometer and its anticipated impact on life sciences and commercial space related applications

Development of advanced materials with graphite/graphene-based resins and thin metals for flexible OLED displays, providing heat dissipation, impact resistance, light shielding, and EMI shielding.

We have developed a new diamine PHBAAB, a polyimide raw material, and obtained patent rights. We have developed functional soluble polyimides (high elasticity, high strength, low thermal expansion, low dielectricity, etc.) using a novel diamine and applied them to various applications. This time, a high-elasticity, high-strength, low-electrolyte swelling polyimide binder that can be dried at low temperatures using PHBAAB has been completed, contributing to the high capacity of next-generation LIB batteries. We design and develop a new functional soluble polyimide resin using our proprietary "PHBAAB". The company aims to put into practical use proprietary polyimide materials such as "low dielectric performance compatible with high frequency" and "high strength performance for anode materials for next-generation batteries", which are attracting particular attention in the next-generation industrial field. It is design and development with polyimide resin new functionality-soluble using "PHBAAB" of the original development. The "low dielectricity performance having high attention degree in particular for high frequency" "high strength performance for cathode materials in the next generation for batteries" aims at the practical use of original polyimide materials in the next-generation industrial field.

“RASEN Project: Redefining Genomic Analysis with Advanced Acceleration Technology. Mitate Zepto Technica’s RASEN Project is developing a next-gen accelerator that vastly improves genome analysis speed and efficiency. Eliminating reliance on supercomputers, it allows rapid, cost-effective analysis on workstations. By reducing power consumption, RASEN broadens the reach of genomic insights in fields like medicine, agriculture, and environmental science.”

We provide semiconductor design technology centered around "Dualibus," a wireless communication technology. By incorporating chips equipped with Dualibus into hardware, we make it easier to install devices in locations that were previously challenging due to shape and installationconstraints, contributing to expanding edge computing adoption.

As the heat generated by AI servers and other electronic device components rises each year, cooling methods are shifting toward water-cooled systems. In this pitch, we have developed a boiling type cooling system that has lower flow rate and lower pressure loss than the water-cooling system.